On June 24, the 2023 National Science and Technology Awards were announced in Beijing, and a total of 250 projects were selected. The "Key Technologies and Equipment for High-Density Interconnect Packaging Manufacturing for High-Performance Chips" led by the team of Professor Chen Xin of GDUT won the second prize of National Science and Technology Progress Award. This is the third National Science and Technology Award won by Professor Chen Xin's team, the last two in 2014 and 2019, with GDUT as the first completion unit. It is also a landmark achievement of building a high-level innovative university in comprehensively promoting the discipline upgrading project of the "1 +2 +3" climbing and supporting plan.
