Research

School

School of Electromechanical Engineering

Title

Professor, PhD Supervisor

Research Interests

microelectronic packaging materials and processes

Home Page

Contacts

13822120193

Personal Introduction

Prof. Cui has extensive research and industrialization experience in chip, MEMS sensor, optical fiber communication packaging material and wafer level packaging technology. He is the first one to put forward and fully master the new key technology to produce high density packaging substrate —— improved semi-addition technology and ultra-micro all-copper blind hole filling technology, and has successfully implemented the production and industrialization of products in Hong Kong Jinbai Technology Co., Ltd and Ageli Electronic Technology (Suzhou) Co., Ltd. He is the Distinguished professor of "100-person program "of Guangdong University of Technology ,the doctoral supervisor, the deputy director of the State Key Laboratory of electronic precision manufacturing technology and equipment "co-built by the provincial and department.He has head the National 02 Project, 863 Program and other scientific and technological research and technological innovation projects. He has more than 20 years of research experience in the field of microelectronic packaging materials and processes. As of 2019, he has obtained more than 50 authorized patents at home and abroad, published more than 120 papers in domestic and international famous journal journals, and co-authored two monographs “Polymer Surface Reconstruction (surface grafting)" and "Advanced Chip Packaging Reliability ".

Education

1. 1989/1-1991/3, University of Essex, Electrochemistry, PhD

2. 1983/9-1985/12, Tianjin University, Electrochemistry, Master

3. 1979/9-1983/7, Tianjin University, Electrochemical Engineering, Bachelor

Work Experience

1. 2016.09-present, Distinguished Professor at the School of Mechanical and Electrical Engineering of GDUT, PhD supervisor

2. 2012.05-2016.08, Anjieli Industrial Co., Ltd., Chief Technology Officer (CTO)

3. 2006.05-2012.05, Hong Kong Jinbai Technology Co., Ltd., Chief Technology Officer (CTO)

4. 1995.05-2006.05, Researcher, Singapore Institute of Microelectronics

5. Researcher Li Guangyao, National University of Singapore, November 11, 1991-May 1995

6. 1990.07-1991.10, University of Essex, UK, postdoctoral fellow

Part-time Academic Job

1.A technologist IN Anjieli Industrial Co., Ltd

2.A Member of China Flexible Electronic Technology Committee

3. A Double Employed Professor in Shenzhen Institute of Wide-Bandgap Semiconductors

4.The Chairman in the 21st International Conference on Electronic Packaging Technology

5.A Senior Adviser in National Center for Advanced Packaging Co., Ltd.

6. A Adviser in Dongshuo Science Co., Ltd.

7. Adjunct Professor in Ho Ying Tung Institute of Hong Kong University of Science and Technology

8. Consultant of Hong Kong Academy of Applied Sciences

9. Visiting Fellow of State Key Laboratory of Semiconductor Lighting in Changzhou

Main Honors

2018,the First Prize of Guangdong Provincial Prize for Progress in Science and Technology

2017,the Second Prize of Jiangsu Provincial Prize for Progress in Science and Technology

2017, China Patent Excellence Award

2015.10, Jiangsu Province "Double Talents"

2014.12, Suzhou "Gusu leading talent"

2013.06, Guangzhou "Innovation and Entrepreneurship Leader"

2013.02, National high-level talent

1993, Lee Kuan Yew Top Research Award

Main Achievements

Since 2016, he has served as a full-time professor and doctoral supervisor in the School of Mechanical and Electrical Engineering of Guangdong University of Technology. At present, two doctoral students and 16 master students are being trained , and having guide students in the relevant scientific research of the Guangdong Provincial International Cooperation Project and the National Natural Science Foundation of China. At the same time, he had instructed students to write more than 10 papers and publish more than 30 invention patents.

While carrying out scientific research , he also offers courses on Advanced Microelectronics Packaging Technology and Surface Mounting Technology to doctoral, master and undergraduate students.

Main Projects

1.2019-2022, a general program of National Natural Science Foundation: Controlled Cu-silver Bimetallic Core-shell Nanostructure EncapsulationInterconnection and Low-temperature Pressure-free Sintering Mechanism;

2.2019-200, National Key R & D Projects( Strategic International Science, Technology and Innovation Cooperation Focus): Research and Application of Nano-copper Materials and Technology for Advanced Packaging Interconnection;

3.2017-2018, Department of Science and Technology of Guangdong Province: Breakthrough of the Bottleneck of Semiconductor Inter Application of Nano-copper Powder;

4.2014-2016, National “02” Special Project : Technology Research and Industrialization of High-density Ultra-thin Flexible Package Substrate

5.2015-2017,National “863” Project Research and Technological Innovation Projects: Research on Third Generation Semiconductor Packaging Technology Based on High Performance Substrate;

6. 2015-2018,Guangdong Province Special Project : Research and Industrialization of High Density Ultra-thin Flexible Packaging Substrate;

7. 2015-2018, Special Projects for the Transformation of Major Scientific and Technological Achievements of Department of Science and Technology of Jiangsu Province: Technology Research and Industrialization of High-density Ultra-thin Flexible Package Substrate.

Research Team

The team has 1 professor ,3 associate professors ,2 Ph.D.s ,16 master's degrees, research interests in electronic packaging materials, chemical engineering and technology, mechanical and electronic engineering and other aspects.